Resources for electronic reverse engineering.
Reverse Engineering Process
Step 1: Take photos and part number of the parts from various perspective. If dimension of the part (Size, Length, Pitch) is important, record down the dimension and take photos together with a ruler or a measuring tape.
Step 2: Label and list all the components with a designator ID for all the individual components. Consolidate the quantity.
Step 3: Label all contact point on the individual component. Tablet a list of connection points to map the connections.
Step 4: Source for the components’ part-number, manufacturer, distributor (where to buy) and the price.
Marking Code References
SOT23 Marking Code
Check out the SOT23 Marking Code here.
Footprint similar to SOT23-3 (pitch 1.9mm) but smaller in size are
SC-70-3 (1.3mm), SOT323 (1.3mm), SOT416 (1mm)
Diode Marking Code
Check out the Diode Marking Code here.
National Semiconductor IC chip marking convention
http://www.ti.com/lit/an/snoa039c/snoa039c.pdf
SMD-CODES Databook
Active SMD Components
Marking Codes, Marking Style, Characteristics Pinout
http://www.go-gddq.com/down/2014-04/14040108467284.pdf
https://www.sos.sk/pdf/SMD_Catalog.pdf
Reference Designator on PCB board
https://en.wikipedia.org/wiki/Reference_designator
Others
http://www.siongboon.com/projects/2013-09-22_reverse_engineering/
Electronic Reverse Engineering Service
PIC-CONTROL provide electronic reverse engineering service for our business clients. Check out our electronic reverse engineering service on our website or contact us for further information.