Resources for electronic reverse engineering.
Reverse Engineering Process
Step 1: Take photos and part number of the parts from various perspective. If dimension of the part (Size, Length, Pitch) is important, record down the dimension and take photos together with a ruler or a measuring tape.
Step 2: Label and list all the components with a designator ID for all the individual components. Consolidate the quantity.
Step 3: Label all contact point on the individual component. Tablet a list of connection points to map the connections.
Step 4: Source for the components’ part-number, manufacturer, distributor (where to buy) and the price.
Marking Code References
SOT23 Marking Code
Check out the SOT23 Marking Code here.
Footprint similar to SOT23-3 (pitch 1.9mm) but smaller in size are
SC-70-3 (1.3mm), SOT323 (1.3mm), SOT416 (1mm)
Diode Marking Code
Check out the Diode Marking Code here.
National Semiconductor IC chip marking convention
Active SMD Components
Marking Codes, Marking Style, Characteristics Pinout